As a follow on to our first MCM paper, we built a tool called IMPACT to make it easier for chip designers to explore different packaging options early on in the design process. We were invited to add to our conference paper and improve it for an IEEE Transactions on Components, Packaging, and Manufacturing Technology journal article.
This paper explores early analysis of the complex relationships between system architectures and the active and packaging materials from which they are implemented. The goals of this analysis are to enable the designer to specify cost effective technologies for a particular system, and to uncover resources which may be exploited to increase performance of such a system, early in the design process. We describe a prototype tool called IMPACT, which will predict cost, performance, power, and reliability, and present several case studies demonstrating its use.